Luna's Column
What Is Via-in-pad?
Via-in-pad is the design of placing the via inside the copper pad, and it is usually used for space optimization of the PCB. The PCB can provide up...
What are the plated-through slots?
Plated-through slots, metal slots, and cut-outs refer to the same technology in PCB manufacturing. A plated slot means a slot is plated with c...
What is the surface finish?
Surface finish is one of the PCB fabrication processes. It is also called surface treatment or surface coating. PCB surface finish acts like a clot...
What are the gold fingers?
Gold fingers are the gold-plated narrow connectors on the edge of printed circuit boards (PCBs), building connections between multiple boards or be...
PCB design & layout
A printed circuit board (PCB) design is not an easy thing. It is a critical part of the design of electronics product and includes PCB routing an...
Advantages of mixed assembly
What is the mixed assembly?
Though surface mount technology has become the main mounting method in PCB manufacturing, there are still some componen...
3 advantages of SMT assembly
SMT, the full name is surface mount technology. SMT is a way to mount the components or parts onto the boards. Due to the better outcome and higher...
What is a through-hole assembly?
Through-hole assembly is a method for producing electronic circuits in which the components are installed through leads. It refers to the mounting ...
The comparison of PCB with edge plating and PCB without edge plating
PCB edge plating
PCB edge plating is the process of connecting the top and the bottom of the PCB by electroplating around the outer edges of the...
3 printing methods of silkscreen
The silkscreen is usually the white images or texts we often see on the PCBs. The ink silkscreen uses a non-conductive epoxy ink. The standard colo...
What are the vias, blind vias, and buried vias?
Regular vias are the copper-plated holes on a two-layers board, and they build a connection of the surface layers. This kind of via is named as a t...
BGA Assembly Capabilities
BGA refers to a ball grid array, which is an advanced packaging technology in SMT assembly. BGA is the result of the development of electronic tech...