Mindy's Column
About SMT patch-furnace temperature curve operation
1. Purpose: Standardize the relevant personnel to set the furnace temperature curve correctly to ensure the quality of SMT products.
2. Scope: suit...
Process analysis of high-speed and high-frequency copper clad laminates
Copper-clad laminate is also known as base material. It is a plate-like material formed by hot pressing by impregnating a reinforcing material with...
Introduction to Advanced Flip Chip Packaging Technology
Flip chip, as the name suggests, is a packaging method in which the front side of the chip (the side where the IC circuit is made) is connected to ...
How to understand PCB stackup design
In general, the PCB stack-up design must follow two rules:
1. Each wiring layer must have an adjacent reference layer (power or ground layer);
2. T...
Advantages and Disadvantages of FPC (flexible circuit board)
1, Disadvantages of FPC:(1) High initial cost at one timeSince soft PCB is designed and manufactured for special application, the cost of circuit d...