Lily's Column
IC Package Principles and Functional Characteristics
This article will introduce some of the packaging principles and functional characteristics of everyday ICs. By understanding the packaging of vari...
Ball Grid Array (BGA) advantages disadvantages and its types
Ball Grid Array (BGA) and Types:
Today most of the electronic gadgets, equipment and many hand held electronic devices are extensively using miniat...
What is air gap construction method in rigid-flex boards?
To address the reliability issues of rigid-flex PCB, IPC has developed a construction method known as air gap construction.
6 layer rigid-flex PCB...
What is a BGA package?
BGA is the abbreviation of Ball Grid Array. This, in a general form, is an array of small sized / tiny metallic conductor balls that are arranged ...