Lily's Column
Importance of PCB trace width during PCB design
IMPORTANCE OF TRACE WIDTH
PCB traces connect all kinds of electrical signals from one junction to another. The signals may be analog, digital, or p...
Lay Stack up design guidelines
1. Inner board design requirement
The edge of the inner board is filled with dummy pads.The pad diameter is required to be 4.0mm, and the sp...
Why are PCB multilayer boards all even-numbered layers?
Why are PCB multilayer boards all even-numbered layers?
13 Basic Rules Of PCB Layout
1. According to the circuit module layout, the relevant circuit for realizing the same function is called one module, and the components in the ...
Rigid-Flex PCB
it was a 6Layer rigid +2Layer Flex which designed with HDI 1+N+1laser drilling.FR4 TG170,board thickness 1.2mm ,Copper 1oz, ENIG , Solder mask Gre...
Wireless charging coil FPC
Wireless charging coil FPCNumber of Layers: 2Monolithic size: XMM / any customizationCopper thickness: 1OZBoard thickness: 0.2MM + 0.03MMPI + coppe...
What is BGA Chip ?
BGA (Ball Grid Array) is a technology for surface mounting ICs using small balls on the underside of the chip package instead of pins. BGA is some...
What’s the Difference Between Single-sided , Double-sided and Multilayer Flex PCB(FPC)
PCBs are used in electronic products, and the market trend of PCBs is almost the vane of the electronics industry. With the development of high-end...
What is impedance control PCB?
Impedance Control PCB is the characteristic impedance of a transmission line formed by PCB conductors. It is relevant when high-frequency. signals...
4 Tips in high-speed (>100MHz) high-density PCB design
1. Control the continuity and matching of the trace characteristic impedance.
2. The trace space
3. Use blind/buried via to increase the area of the track.
4. Differential termination and common-mode termination can be reserved to mitigate the effects on timing and signal integrity.
How to Plan Multilayer PCB Stackup ?
Design A Multilayer PCB , One of the important things is planning the Multilayer PCB stack-up in achieving the best possible performance of a prod...