Licky's Column

Back Drilling --- A special craftsmanship of control depth drilling

Back Drilling --- A special craftsmanship of control depth drilling

What is Back Drilling? Backdrill is the process of creating vias by removing the stub in multilayered printed wiring boards, to allow signals to fl...

The Fundamental Analysis of QFP vs QFN Packages

The Fundamental Analysis of QFP vs QFN Packages

QFN package QFN (quad flat no-lead) package is a semiconductor set connecting ASCIC to Printed circuit board (PCB). To achieve this, QFN utilizes S...

BGA Soldering Quality Detection Techniques by X-Ray Imaging

BGA Soldering Quality Detection Techniques by X-Ray Imaging

Introduction: BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in t...

How to prevent the PCB from being bended and warped when get through the reflow furnace

How to prevent the PCB from being bended and warped when get through the reflow furnace

Everyone knows that PCBs are easy to be bended or warped when get through the reflow furnace. So how to avoid this situation, here are some advices...

7 Steps To Determine PCB Layout and Wiring

7 Steps To Determine PCB Layout and Wiring

The design should be carefully analyzed and the tool software should be carefully set before starting wiring, which will make the design more in li...

General introduction of SMD Adhesive

General introduction of SMD Adhesive

SMD Adhesive is also called Surface Mount Adhesive.Before soldering, components with pin contacts or SMDs are often bonded to the PCB with adhesive...