Licky's Column

0.4mm fine pitch BGA PCB Design guideline

by Licky Li

0.4mm fine pitch BGA PCB Design guideline

Nowadays, precise components is widely used in some advanced electronics devices, such as fine pitch FPGA component from Xilinx. But this take ext...
Posted in BGA, PCB design

Key Points of SMT Assembly Process for BGA Components

by Licky Li

Key Points of SMT Assembly Process for BGA Components

The advent of BGA (ball grid array) definitely decreases assembly defects when SMT (surface mount technology) / SMD (surface mount device) practiti...
Posted in BGA

4 Steps to Know BGA

by Licky Li

4 Steps to Know BGA

Feel dizzy confronted with some short terms such as SMT, LED, CMRR, CCD or even PCB? These short terms make our communications easy, convenient and...
Posted in BGA, Chip

How to Get BGA Perfectly Soldered on PCBs in SMT Assembly

by Licky Li

How to Get BGA Perfectly Soldered on PCBs in SMT Assembly

Because BGA (Ball Grid Array) solder balls are hidden under the body, it’s quite difficult to inspect their performance. Up to now, Automated X-ray...
Posted in BGA, pcba, soldering

BGA vs. LGA: The Difference between the Two Grid Arrays

by Licky Li

BGA vs. LGA: The Difference between the Two Grid Arrays

Remember when we had to deal with huge ICs? Thankfully, that era is over, and we now have access to smaller compact ICs. Undoubtedly, manufacturers...
Posted in BGA, Chip, IC, LGA

What Causes BGA Crosstalk?

by Licky Li

What Causes BGA Crosstalk?

BGA packages are noted for their compact size and high pin density.  The type of signal crosstalk that results from ball arrangement and misass...
Posted in BGA

How to Get BGA Perfectly Soldered on PCBs in SMT Assembly

by Licky Li

How to Get BGA Perfectly Soldered on PCBs in SMT Assembly

Because BGA (Ball Grid Array) solder balls are hidden under the body, it’s quite difficult to inspect their performance. Up to now, Automated X-ray...
Posted in BGA, PCB, PCB design, PCB fabrication, PCB layout, PCB manufacturing

Key Points in Manufacturing Mechanical Blind-Via

by Licky Li

Key Points in Manufacturing Mechanical Blind-Via

Introduction: Mechanical blind through-hole PCB means that both the blind holes and the through-hole of the plate are formed by the process of mech...
Posted in BGA, PCB, PCB design, PCB fabrication, PCB layout, PCB manufacturing

BGA Soldering Quality Detection Techniques by X-Ray Imaging

by Licky Li

BGA Soldering Quality Detection Techniques by X-Ray Imaging

Introduction: BGA is a typical high-density packaging technology. Its characteristics are that the chip pins are distributed under the package in t...
Posted in BGA, PCB, PCB design, PCB fabrication, PCB Layer stack-up, PCB layout, PCB manufacturing

What is ball grid array (BGA)?

by Licky Li

What is ball grid array (BGA)?

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such ...
Posted in BGA, HDI PCB, PCB, PCB design, PCB fabrication, pcba