PCB reverse engineering, or reverse technology, is the reproduction, reverse analysis, and research of a target PCB board's design technology. It involves deducing a product's processing flow, structure, functional features, and technical specification elements to make products with similar functions. Originating from commercial and military hardware analysis, its main aim is to analyze a finished product and figure out its design principle when production information is hard to obtain.
At PCB-HERO, we provide Printed Circuit Board Reverse Engineering service. We can take your sample, components included, and conduct a full reverse engineering process. We'll generate all the data required for duplication. Even boards with programmed ICs, custom parts, and obsolete parts can be reverse engineered by us.
What is PCB Reverse Engineering?
It is the process of disassembling and analyzing a physical product to generate documentation, remanufacture, and determine how it was designed and operates. Often the documentation even allows a customer to improve their product to surpass competitors.
What reverse engineering services can we offer you?
PCB-HERO is a leading electronic reverse engineering firm in Shenzhen, China, with over a decade of experience in this field. Our team can handle any task related to electronic hardware reverse engineering. We offer to reverse engineer and remanufacture obsolete or unsupported electronic circuit boards and card assemblies.
Electronic hardware reverse engineering involves determining in our lab how an item was designed and functions, allowing us to reproduce it from the printed circuit board to the schematic. We can repair your PCB, copy or clone it (when the OEM no longer supports it and the reverse engineering is legal), and even upgrade your hardware to ensure the replacement is a perfect replica in form, fit, and function. We always check for intellectual property rights before starting work. We aim to provide the best customer support in the PCB clone and copy industry.
PCB reverse engineering utilizes 3D scanner technologies like laser scanners, structured light source converters, or X-ray tomography to measure dimensions based on existing physical components and then build 3D virtual models using CAD, CAM, CAE, or other software.
Two popular reverse engineering techniques are PCB copy board and chip decryption. PCB reverse design analyzes physical electronic products and circuit boards to reverse engineer original PCB files, BOM files, schematics, and technical files, enabling the manufacturing, soldering, testing, and debugging of PCBs to fully copy the original template. Chip decryption, or IC/MCU decryption, uses specific equipment and methods to directly obtain the encrypted programming file in the MCU, allowing you to copy, program, or disassemble it for reference and research. Attackers can exploit vulnerabilities or software defects in single-chip designs to extract critical information and obtain the program within the microcontroller through various technical means.
PCB Reverse Engineers Regular Flow Process :
First step:
Obtain a PCB. Record the model, parameters, and position of all components on paper, noting diode, triode, and IC gap directions. Take two photos of component locations with a digital camera, as some diodes and transistors may be hard to notice on advanced PCBs.
Second step:
Remove all components and tin from PAD holes. Clean the PCB with alcohol and scan it. Slightly raise scanned pixels for a clearer image. Polish the top and bottom layers with water - gauze paper until the copper film shines, then scan each layer separately in color using Photoshop, ensuring the PCB is placed horizontally and vertically.
Third step:
Adjust the canvas contrast and brightness in Photoshop until the copper - film and non - copper - film areas have a strong contrast. Convert the second image to black and white and check line clarity. If not clear, repeat. Save clear images as black - and - white BMP files (TOP.BMP and BOT.BMP), and use Photoshop to repair any issues.
Fourth step:
Convert the two BMP files to PROTEL format and transfer the two layers in PROTEL. Ensure PAD and VIA positions coincide. If there's a deviation, repeat the third step. PCB copying demands patience as small issues can affect copy quality.
Fifth step:
Convert the TOP - layer BMP to TOP.PCB, converting to the SILK (yellow) layer. Trace lines on the TOP layer and place devices as per the earlier drawing, then delete the SILK layer. Repeat for all layers.
Sixth step:
Import TOP.PCB and BOT.PCB into PROTEL and combine them into one image.
Seventh step:
Print the TOP and BOTTOM layers on transparent film (1:1 ratio) using a laser printer. Place the film on the PCB to check for errors. If correct, the physical copy is done. However, it's essential to test the copy board's electronic technical performance against the original.
Remarks:
For multi - layer boards, carefully polish to the inner layer and repeat steps three to five. Graphic naming varies by layer number. Double - sided copying is simpler than multi - layer. Multi - layer copy boards are prone to misalignment, especially with internal vias and non - vias, so extra caution is needed.
Multilayer PCB Reverse Engineering Operation Method
Step 1: Preparation
Inspect the circuit board for high - position components. Record component location number, package, temperature value, etc. Scan the board before component disassembly as backup. After removing high - position components, scan the remaining SMD and small components at 600dpi. Clean the PCB surface to ensure clear IC and PCB characters in the scan.
Inspect the circuit board for high - position components. Record component location number, package, temperature value, etc. Scan the board before component disassembly as backup. After removing high - position components, scan the remaining SMD and small components at 600dpi. Clean the PCB surface to ensure clear IC and PCB characters in the scan.
Step 2: Disassemble components and make BOM
Use a small air gun to heat components. Remove resistors first, then capacitors, and finally ICs. Record any dropped or reversed components. Prepare a component record table with number, package, model, value, etc. Paste double - sided tape on the table, write position numbers, and stick removed components. Measure component values with a bridge, measuring after the device cools for accuracy. Input data to the computer for archiving.
Use a small air gun to heat components. Remove resistors first, then capacitors, and finally ICs. Record any dropped or reversed components. Prepare a component record table with number, package, model, value, etc. Paste double - sided tape on the table, write position numbers, and stick removed components. Measure component values with a bridge, measuring after the device cools for accuracy. Input data to the computer for archiving.
Step 3: Removing tin on the surface
Use flux and a tin - suction wire to remove remaining tin dross on the PCB. Adjust soldering - iron temperature based on PCB layers (increase for multi - layer boards but avoid burning the ink). Wash the board with board - washing water or thinner and dry it.
Use flux and a tin - suction wire to remove remaining tin dross on the PCB. Adjust soldering - iron temperature based on PCB layers (increase for multi - layer boards but avoid burning the ink). Wash the board with board - washing water or thinner and dry it.
Step 4: Real - time operation in the copy board software
Set scanned surface images as top and bottom layers and convert to bottom images for copying software. Package components (silkscreen, pad aperture, positioning holes, etc.). Place components in position, adjust characters. Sand off silkscreen, ink, and characters on the PCB with sandpaper (sand pads perpendicular to scanner's scanning direction). For multi - layer PCBs (e.g., 8 - layer), copy from outside to inside. Adjust for scan - board errors and ensure base - map size and component position are correct for via placement, wiring, and copper laying.
Set scanned surface images as top and bottom layers and convert to bottom images for copying software. Package components (silkscreen, pad aperture, positioning holes, etc.). Place components in position, adjust characters. Sand off silkscreen, ink, and characters on the PCB with sandpaper (sand pads perpendicular to scanner's scanning direction). For multi - layer PCBs (e.g., 8 - layer), copy from outside to inside. Adjust for scan - board errors and ensure base - map size and component position are correct for via placement, wiring, and copper laying.
Step 5: Check
Use image and PCB drawing software, along with circuit physical connection, for inspection. For high - frequency boards, test impedance with an impedance tester or slice the PCB and measure with a metallurgical microscope.
Use image and PCB drawing software, along with circuit physical connection, for inspection. For high - frequency boards, test impedance with an impedance tester or slice the PCB and measure with a metallurgical microscope.
Precision adjustment correction
Copy - board accuracy depends on software and original - image accuracy. Software with 32 - bit floating - point has no practical accuracy limit. Higher DPI (dots per inch) in scanning gives higher accuracy. Set DPI according to board precision needs. For general - precision boards, 400DPI is usually sufficient; for mobile - phone boards with high precision (sub - line spacing < 1mil), set DPI above 1000DPI. Higher DPI means larger pictures and higher hardware requirements.
Copy - board accuracy depends on software and original - image accuracy. Software with 32 - bit floating - point has no practical accuracy limit. Higher DPI (dots per inch) in scanning gives higher accuracy. Set DPI according to board precision needs. For general - precision boards, 400DPI is usually sufficient; for mobile - phone boards with high precision (sub - line spacing < 1mil), set DPI above 1000DPI. Higher DPI means larger pictures and higher hardware requirements.
Choose us for professionalism, efficiency, and peace of mind. We look forward to working with you to unlock the limitless possibilities of the electronics world. If you have any needs, please feel free to contact us. We will be happy to serve you