What do microvia hole, blind via hole and buried via hole mean?

Microvia hole

According to the new definition within IPC-T-50M a microvia is a blind structure with a maximum aspect ratio of 1:1, terminating on a target land with a total depth of no more than 0.25mm measured from the structure’s capture land foil to the target land.

Blind via hole

It is a hole that runs from an outer layer to the inner layer, but not through the entire PCB. These holes can be drilled mechanically or using laser technology.The image shows a laser drilled blind via.

Buried via hole

This is a hole that runs between one or more inner layers. They are normally mechanically drilled.


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