1)Solder paste - reflow soldering process, the characteristics of the process are simple and fast, which is conducive to the reduction of product volume.

2)Patch - wave soldering process, the characteristics of this process is the use of double-panel space, the volume of electronic products can be further reduced, and through-hole components are still used. The price is low, but the equipment requirements are increased, the wave soldering process has more defects, and it is difficult to achieve high-density assembly.

3)Mixed installation, this process is characterized by full use of the double-sided space of the PCB board, which is one of the methods to minimize the installation area, and still keep the characteristics of the low price of through-hole components.

4) Solder paste- reflow soldering process is used on both sides. The characteristics of the process can fully utilize the PCB space and minimize the installation area. The process control is complex and strict. It’s often used in dense or ultra-small electrical products. Mobile phones are one of the typical products.

We know that in the new materials, solder paste and glue are thixotropic fluids. They accounted for 60% of SMT total defects, training knowledge of these materials to ensure the quality of SMT. SMT involves a variety of loading process, such as printing, dispensing process, placement process, curing process, as long as any one of the process parameters drifts, it will lead to defective products, SMT process personnel must have a wealth of process knowledge, Monitor the process status at any time and predict the development trend.