Process flow of Rigid-Flex PCB 2

Case 2: Motorola 1+2F+1

PCB features: 1+HDI design

BGA Pitch: 0.5mm

Flex board thickness: 25um without IVH hole design, the whole

PCB thickness: 0.275+/-0.028mm

Inner LW/SP: 3/3mil

Surface treatment: ENIG + Silver Paste

Process flow of Rigid-Flex PCB 2




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