Lisa's Column
Routing Rules of BGA package in PCB design
When routing a Ball Grid Array (BGA) package in PCB design, several important considerations should be kept in mind to ensure the integrity and fun...
Designing an HDI board with 0.4 and 0.65mm BGAs
Designing a High-Density Interconnect (HDI) board with 0.4mm and 0.65mm Ball Grid Array (BGA) packages presents unique challenges due to the fine p...
Can't-Miss Layout Tips for BGA Chips
With the development of chip packaging technology, BGA (ball grid array) has been regarded as a standard packaging form. As far as chips with hund...
BGA Packaging Technology and Traditional SMT/SMD
SMT (surface mount technology) is presented relative to traditional THT (through hole technology). Compared with THT assembly, SMT assembly saves ...