Lisa's Column
Why Does a Ball Grid Array (BGA) Need Reballing?
Ball Grid Array (BGA) reballing is a process required for several key reasons related to the repair, upgrade, and maintenance of electronic compone...
4 Common BGA Rework Mistakes and How to Avoid Them
BGA (Ball Grid Array) rework is a complex process that requires precise execution to ensure successful repair and functionality. Here are four comm...
3 Common BGA Rework Challenges
Ball Grid Array (BGA) rework is a precise and complex process that presents several unique challenges. Addressing these challenges effectively is c...
Everything You Need to Know About BGA Soldering
Ball Grid Array (BGA) reballing is a process required for several key reasons related to the repair, upgrade, and maintenance of electronic compone...
Routing Rules of BGA package in PCB design
When routing a Ball Grid Array (BGA) package in PCB design, several important considerations should be kept in mind to ensure the integrity and fun...
Designing an HDI board with 0.4 and 0.65mm BGAs
Designing a High-Density Interconnect (HDI) board with 0.4mm and 0.65mm Ball Grid Array (BGA) packages presents unique challenges due to the fine p...
Can't-Miss Layout Tips for BGA Chips
With the development of chip packaging technology, BGA (ball grid array) has been regarded as a standard packaging form. As far as chips with hund...
BGA Packaging Technology and Traditional SMT/SMD
SMT (surface mount technology) is presented relative to traditional THT (through hole technology). Compared with THT assembly, SMT assembly saves ...