Printed Circuit Boards Glossary:Design,Fabrication and Assembly

Acceptance Test
Accepted Quality Level (AQL)
Access Holes
Accuracy
Acrylic Resin
Activating
Additive Process
Adhesion Layers
Adhesive
Aging
Air Gap
Algorithm
Ambient
Analog Circuit
Analog Circuit Simulator
Analog Functional Test
Analog In-circuit Test
Anchoring Spur
Angle of Attack
Annotation
Annular Ring
ANSI
AOI
Aperture List
AQL
Aqueous Cleaning
Arc Resistance
Artwork
Artwork Master
ASCII
Aspect Ratio
Assembly Drawing
Assembly House
Assembly Language
ATE
Automated Component Insertion
Automatic Test Equipment
AWG
Axial Lead
Azeotrope

 

B&B
Backdriving
Backpanel (Backplane)
Bare Board
Barrel
Base Copper
Base Laminate
Base Material
Base Material Thickness
Base Solderability
Basic Wettability
BBT
Bed-of-Nails
Bellows Contact
BGA
Biscuit Frame
Bleeding
Blind Via
Blister
Blistering
Blow Hole
Bluetooth
Blutter Coat
Board Density
Board Thickness
Body
Bond Interface
Bond Lift-off
Bond Strength:
Bonding Layer
Bonding Time
Border Data
Boundary Scan
Bow
Branched Conductor
Brazing Alloy
Breakdown Voltage
Bridged Joint
Bridging
B-stage
B-stage Material
B-stage Resin
Bulge
Buried Via
Burn-in
Bus
Bus Bar
Bypass Capacitor

CAD system
CAD/CAM system
Capacitive Coupling
Capillary Action
CARD
Cast Adhesive
Catalyst
Chamfer
Characteristic Impedance
Check Plots
Chemical Conversion Coating
Chemical Hole Clearing
Chemically-deposited Printed Chip on board
Chip Testers
Circuit Tester
Circumferential Separation
Clad
Clad or Cladding
Clamshell Fixture
Class Transition Temperature
Clearance
Clearance Hole
Clinched-wire through Connection
Coating
COB
Coefficient of Expansion, Thermal-CTE
Cold Solder Connection
Compatibility
Compiler
Component
Component Density
Component Hole
Component side
Conductive Adhesive
Conductive Foil
Conductive Pattern
Conductor
Conductor Base width
Conductor Layer
Conductor Pattern
Conductor Side
Conductor Spacing
Conductor Thickness
Conductor Width
Conductor-to-hole Spacing
Conformal Coating
Connection
Connector Tongue
Contact Area
Contact Resistance
Contact Spacing
Contaminate/Contaminant
Continuity Testing
Copper Clad
Copper Foil-See Foil
Copper-mirror Test
Corner Mark
Corrosive Fluxes
Cosmetic Defects
Coupon
Cover Lay, Cover Layer, Cover Coat
Cracking
Crazing
Crimp Contact
Cross-hatching
Cross-linking
Cross-talk:
C-stage Material Laminate:
Cure
Current-carrying Capacity
Cut
Cycle Rate 

Database
Datum
De-bugging
De-lamination
Dendrite
Design Width of Conductor
Device
De-wetting:
Dezincification
DFSM
Dice
Die
Dielectric
Dielectric Constant
Dielectric Strength
Digital Circuit
Digital Logic Simulator
Digitizing
Dimensional Hole
Dimensional Stability
DIP Soldering
Discrete Component
Dispersent
Disturbed Solder Connection
Documentation
Double-sided Assembly
Double-sided Board
DPF
Drag Soldering
Drag-out
DRC
Drills
Dross
Dry Film Resists
Drying Time
Dual Solder Wave
Dummy Component
Durometer

Edge Clearance
Edge Connector
Edge Spacing
Edge-board Contacts
Electroless Copper
Electroless Deposition
Electron-beam Bonding
Electroplating
Embedded Component
Emulsion Side
Entrapment
Epoxy Resins
Epoxy Smear
ERBGF
ERC
Escape Rate
ESD
ESD Sensitivity
Etch Factor
ETCH Resist
Etchant
Etch-back
Etched Printed Board
Etching
Exotherm
Extraneous Copper
Eyelet

 

Fault List
Feed-through
Fibre Exposure
FICS
Fiducial
Fillet
Fine Line Design
Fine Pitch
Finger
First Pass Yield
Fixture
Flat Cable
Flexible Printed Wiring
Flexure Failure
Flood Bar
Flow Soldering
Fluorocarbon
Flush Conductor
Flux
Flux Residue
Flux, Activated Rosin Flux
Flux-cored Solder
Foil
Footprint
Forced-air Convection
FR4
Fully-Additive Process
Functional Test
Fused Coating

 

Gas Blanket
Gerber
GI
Glass Epoxy
Glob Top
Go/No-Go Test
Grid
Ground Plane
Ground Plane Clearance
Guided Probe Method
Gull Wing Lead

 

H.D.I
Halides
Halogenated Polyester
Haloing Mechanically
HASL
Heat and Pull
Heat Sink
Heel,Bonding
Hipot Test
Hole Breakout
Hole Density
Hole Location
Hole Pattern
Hole Pull Strength
Hole Void
Hot Zone
Hygroscopic

 

IC
Immersion Plating
Impedance, Characteristic
In-circuit Test
Inclusion
Indentation
INDEX EDGE
Initiating
Inspection Lot
Inspection Overlay
Insulation Resistance
Inter-facial Connection
Inter-layer Connection
Internal Layer
Interstitial Via Hole
IPC
Isolation

 

J-leads
Jumper
Just-in-time(JIT)

 

Kapton
Key
Keying Slot or Polarizing Slot
Keyway

 

Laminate
Laminate Presses
Laminate Thickness
Laminate Void
Lamination
Land
Land Pattern
Landless Hole
Laser
Layer
Layer-to-Layer Spacing
LCCC
Lead
Lead Mounting Hole
Lead Projection
Legend
Lifted Land
Line
Liquation
Liquids
Load Test
Locating Edge, Locating Hole, Locating Notch, Locating Slot
Locating Hole, Locating Notch, Locating Slot
Logic diagram

 

Major Defect
Manhattan Distance
MAR(Minimum Annular Ring)
Margin
Mask
Mass Soldering
Master Artwork
Master Drawing
Master Pattern
Maximum, Plated Through-hole Size
MCR
Mean Time between Failure (MTBF)
Measling
MELF
Melting Range
Meniscus
Metal Clad Base Material
Metallization
Micro-sectioning
Micro-strip
Mil
Minimum Electrical Spacing
Minor Defect
Mis-registration
Mixed Component-Mounting Technology
Modifier
Module
Mother Board
Mounting Hole
Muffle
Multi-layer PCB
Multimeter
Multiple-image Production Master

Nail Heading
Negative (Noun)
Negative–acting Resist
Netlist
Neutralizer
NFP
Node
Non-clean solder
Non-conductive Epoxy
Non-conductive Pattern
Non-functional Land
Non-polar Compound
Non-wetting
NPTH

 

Omegameter
One-sided Board
Open
Organic Activated (OA)
OSP
Outgassing
Outgrowth
Overhang

 

Packaging Density
Pad
Panel
Panel Plating
Parylene
Pattern
Pattern Plating
PCB
PEC
Peel Strength
Permanent Mask
Photomaster
Photoplotter
Photopolymer
Physical Layer
Pick-and-place Machine
PIH Assembly
Pilot Hole
Pin
Pin Density
Pinhole
Pinholes
Pink Ring
Pit
Pitting
Plate Finish
Plated Through-hole
Plating
Plating Bar
Plating Resists
Plating Up
Plotting
Poise
Polarization
Polyester
Polyimide
Polyimide Resins
Populated PCB
Positive (noun)
Positive-acting Resist
Pre-heat
Prepreg
Press-fit Contact
Primer
Printed Board
Printed Board Assembly
Printed Circuit
Printed Circuit Assembly
Printed Component
Printed Contact
Printed Wiring
Printed Wiring Assembly Drawing
Printed Wiring Board
Printed Wiring Layout
Probing Systems
Process Indicator
Production Master
PTH
Pull Strength
PWB

 

Radial Lead
Reference Edge
Re-flow Soldering
Re-flow Spike
Re-flowing
Register Mark
Registration
Relative Humidity
Reliability
Repair
Repeatability
Residue
Resin
Resin Smear
Resist
Reverse Image
Re-work
Re-working
Rheology
Ribbon Cable
Right-angle Edge connector
Roadmap
Rosin
Rosin Flux

 

Saponifier
Schematic Diagram
Screen
Screen Printing
Semi-additive process
Semi-aqueous Cleaning
Sensitizing
Shadowing
Shielding, Electronic
Shingle-sided Board
Short
Signal
Signal Conductor
Signal Plane
Silkscreen
Simulation
Single-image Production Master
Slump
SMD
Smear
SMOBC
SMT
Snap-off
Snap-off Distance
Soak
Solder (Soft)
Solder Bridging
Solder Connection Pinhole
Solder Fillet
Solder Levelling
Solder Mask, Solder Resist
Solder Masks
Solder oil (Blanket)
Solder Paste
Solder Plug
Solder Projection
Solder Resist
Solder Side
Solderability
Solderability Testing
Soldering
Soldering Iron Tip
Solderless Wrap
Solidus
Spurious Signal
Stamped Printed Wiring
Statistical Process Control(SPC)
Step Soldering
Step-and-repeat
Straight-through Lead
Strain
Stripline
Substrate
Subtractive Process
Supported Hole
Surface Insulation Resistance(SIR)
Surface Insulation Resistance(SIR)Test
Surface Leakage
Surface Mounting
Surface Tension
Surfactant
Swaged Lead

 

Tape-and-reel
Taped Components
Teflon
Temperature Profile
Tented Via
Tenting
Terminal Area
Termination
Terpenes
Test Board
Test Coupon
Test Fixture
Test Pattern
Test Point
Thermocouple
Thermoplastic
Thermoset
Through Connection
Tinning
Tolling Hole
Tombstoning
Trace
Traces
Transmission Cable
Transmission Line
Triazine
Trim Lines
Twist

 

UL
Ultrasonic Soldering
Undercut
Underwriters’ Symbol
Unsupported Hold

 

Vacuum Pick-up
Vapour Phase
Via
Via Hole
Virtual Prototype
Viscosity
Void
Voltage Plane

 

Wave Exposure
Wave Soldering
Weave Exposure
Wetting
Whisker
Wicking

 

Yield

 

Z-Stroke