The clearance around a pad, track, zone or via that defines the nearest approach allowed by conductors of another signal set.
The Institute for Interconnecting and Packaging Electronic Circuits, an American organization.
Interstitial Via Hole
A plated through-hole connecting two or more conductor layers of a multilayer printed board but not extending fully through all the layers of base material comprising the board.
A conductive pattern which is contained entirely within a multi-layer printed board.
An electrical connection between conductive patterns in different layers of a multi-layer printed board. (See also Through Connection.)
See Through Connection.
The electrical resistance of the insulating material (determined under specified conditions) between any pair of contacts, conductors, or grounding device in various combinations.
The electrical resistance of the insulating material (determined under specified conditions) as measured between any pair of contacts or conductors.
A positive or negative transparency made from the production master and used as an inspection aid.
A collection of units of products bearing identification and treated as a unique entity from,which a sample is to be drawn and inspected to determine conformance with the acceptability criteria.
Assemblies of a specific production run selected for inspection or test as a sample of the entire run.
INDEX EDGE MARKER, INDEXING HOLE, INDEXING NOTCH, INDEXING SLOT: See Locating Edge, Location Edge Marker,etc.
A foreign particle in the conductive layer, plating, or base material.
A check of specific components(s) or cuicuits(s) within an assembly without their de-coupling from the primary circuit.
The resistance of a parallel conductor structure to the flow of alternating current (ac), usually applied to high-speed circuits and normally consisting of a constant value over a wide range of frequencies.
The chemical deposition of a thin metallic coating over certain basis metals that is achieved by a partial displacement of the basis metal.