Integrated Circuit Decapsulation

Integrated Circuit (IC)🔌 devices are packaged in black boxes to protect the chip from the environment and to provide a standard outline for Printed Circuit Board (PCB) design and automatic pick and place. 💪Chip, supporting leadframe and interconnection components are encapsulated inside the IC package. Epoxy molding compound is the most widely used material for IC encapsulation due to the low cost and good performance.