1. Check the high-frequency, high-speed, clock and other fragile signal lines to see whether the loop area is the smallest, whether they are far away from interference sources, whether there are redundant vias and windings, and whether there are collapsed ground separation areas.
2. Check whether there are signal lines passing under the crystal, transformer, optical coupling, and power module. Try to avoid threading lines under them, especially grounded copper sheets should be laid under the crystal as much as possible.
3. Check whether the positioning holes and positioning parts are consistent with the structural diagram, and whether the ICT positioning holes and SMT positioning cursors are added and meet the process requirements.
4. Check whether the serial numbers of the devices are correctly placed according to the left-to-right principle, and there is no silk screen covering the pads; check whether the screen printed version number complies with the version upgrade specifications and mark it.
5. Report whether the wiring is 100% complete; whether there are wire ends; whether there are isolated copper sheets.
6. Check that the power supply and ground are correctly divided; the single point common ground has been processed;
7. Check that the light painting options of each layer are correct, and the labeling and light painting names are correct; if panels need to be assembled, only the drawings of the drilling layers are marked.
8. Output the light painting file and use CAM350 to check and confirm that the light painting is generated correctly.
9. Fill out the PCB design (archiving) self-inspection form as required and submit it together with the design documents to the process designer for process review.
10. Actively improve the problems found in the process review to ensure the processability, producibility and testability of the veneer.