STANDARD MULTI-LAYER PCB STACK-UPS 2 4 6 8 AND 10

The tables below represent standard multilayer PCB stack-up structure carried by PCBHERO during PCB fabrication process.. So Standard Multi-layer PCB Stack-ups with all the layers will discuss in detail. All the typical PCB's listed below have the final thickness of 0.62” (1.6mm) ± 10% and 1oz of copper weight. For custom layer stack-up, the following data may not apply. The unit of measurement here for the tables below are listed in riches. The data and values listed below are subject to change without prior notice and will remain at PCBHERO’s discretion.

2-Layer PCB Stack-Up:

  • Top Layer
  • Prepreg
  • Core
  • Prepreg
  • Bottom Layer

Layer Order

Layer Name Material Type Layer Attribute DK(/Er) Thickness Copper Weight
1 Top Copper Signal 0.0014’’

1oz

 

Core Core Core 4.2 0.057’’
1 Bottom Copper Signal 0.0014’’

1oz

Finished board thickness: 0.062’’ (1.6mm) ±10%

4-Layer PCB Stack-Up:

  • Top Layer
  • Prepreg
  • Inner Layer 1
  • Prepreg
  • Inner Layer 2
  • Prepreg
  • Bottom Layer

Layer Order

Layer Name Material Type Layer Attribute DK(/Er) Thickness Copper Weight
1 Top Copper Signal 0.0014’’

1oz

 

2116(2 sheets) Prepreg 4.2 0.0091’’
2 Inner 1 Copper Plane 0.0014’’

1oz

 

Core Core 4.2 0.0037’’
3 Inner 2 Copper Plane 0.0014’’

1oz

 

2116(2 sheets) Prepreg 4.2 0.0091’’
4 Bottom Copper Signal 0.0014’’

1oz

Finished board thickness: 0.062’’ (1.6mm) ±10%

 

6-Layer PCB Stack-Up:

  • Top Layer
  • Prepreg
  • Inner Layer 1
  • Prepreg
  • Inner Layer 2
  • Prepreg
  • Inner Layer 3
  • Prepreg
  • Bottom Layer

Layer Order

Layer Name Material Type Layer Attribute DK(/Er) Thickness Copper Weight
1 Top Copper Signal 0.0014’’

1oz

 

2116 and 3313 Prepreg 4.2 0.0081’’
2 Inner 1 Copper Plane 0.0014’’

1oz

 

Core Core 4.2 0.0013’’
3 Inner 2 Copper Plane 0.0014’’

1oz

 

2116(2 sheets) Prepreg 4.2 0.0091’’
4 Inner 3 Copper Plane 0.0014’’

1oz

 

Core Core 4.2 0.0013’’
5 Inner 4 Copper Plane 0.0014’’

1oz

 

2116 and 3313 Prepreg 4.2 0.0081’’
6 Bottom Copper Signal 0.0014’’

1oz

Finished board thickness: 0.062’’ (1.6mm) ±10%

 

8-Layer PCB Stack-Up:

  • Top Layer
  • Prepreg
  • Inner Layer 1
  • Prepreg
  • Inner Layer 2
  • Prepreg
  • Inner Layer 3
  • Prepreg
  • Inner Layer 4
  • Prepreg
  • Bottom Layer

Layer Order

Layer Name Material Type Layer Attribute DK(/Er) Thickness Copper Weight
1 Top Copper Signal 0.0014’’

1oz

 

1080(2 sheets) Prepreg 4.2 0.0059’’

 

2

Inner 1 Copper Plane 0.0014’’ 1oz
Core Core 4.2 0.009’’

 

3

Inner 2 Copper Plane 0.0014’’ 1oz
7628 Prepreg 4.2 0.0073’’

 

4

Inner 3 Copper Plane 0.0014’’ 1oz
Core Core 4.2 0.0051’’

 

5

Inner 4 Copper Plane 0.0014’’ 1oz
7628 Prepreg 4.2 0.0073’’

 

6

Inner 5 Copper Plane 0.0014’’ 1oz
Core Core 4.2

0.009’’

7

Inner 7 Copper Plane 0.0014’’ 1oz
1080(2 sheets) Prepreg 4.2 0.0059’’

 

8

Bottom Copper Signal 0.0014’’

1oz

Finished board thickness: 0.062’’ (1.6mm) ±10%

 

10-Layer PCB Stack-Up:

  • Top Layer
  • Prepreg
  • Inner Layer 1
  • Prepreg
  • Inner Layer 2
  • Prepreg
  • Inner Layer 3
  • Prepreg
  • Inner Layer 4
  • Prepreg
  • Inner Layer 5
  • Prepreg
  • Bottom Layer

Layer Order

Layer Name Material Type Layer Attribute DK(/Er) Thickness Copper Weight
1 Top Copper Signal 0.0014’’

1oz

 

1080(2 sheets) Prepreg 4.2 0.0059’’
2 Inner 1 Copper Plane 0.0014’’

1oz

 

Core Core 4.2 0.0051’’
3 Inner 2 Copper Plane 0.0014’’

1oz

 

2116 Prepreg 4.2 0.0045’’
4 Inner 3 Copper Plane 0.0014’’

1oz

 

Core Core 4.2 0.0051’’
5 Inner 4 Copper Plane 0.0014’’

1oz

 

1080(2 sheets) Prepreg 4.2 0.0059’’
6 Inner 5 Copper Plane 0.0014’’

1oz

 

Core Core 4.2 0.0051’’
7 Inner 6 Copper Plane 0.0014’’

1oz

 

2116 Prepreg 4.2 0.0045’’
8 Inner 7 Copper Plane 0.0014’’

1oz

 

Core Core 4.2 0.0051’’
9 Inner 8 Copper Plane 0.0014’’

1oz

 

1080(2 sheets) Prepreg 4.2 0.0059’’
10 Bottom Copper Signal 0.0014’’

1oz

Finished board thickness: 0.062’’ (1.6mm) ±10%

 

Each of these stack-ups is designed to provide the necessary electrical performance, signal integrity, and impedance control for various types of circuit designs and applications. The specific material properties and layer thicknesses may vary based on the design requirements, but these stack-ups represent the basic structure for multi-layer PCBs.