7 common IC packaging forms

Integrated Circuit (IC) packaging is crucial for protecting the chip, facilitating its integration onto PCBs, and ensuring reliable electrical connections. Here are seven common IC packaging forms:

  1. Dual In-line Package (DIP): This through-hole package is characterized by two parallel rows of pins. It's commonly used in prototyping and educational applications due to its ease of use.

  2. Surface-Mount Device (SMD): This category includes several types of packages where components are mounted directly onto the surface of PCBs, improving performance and reducing size and weight. Key types include:

  3. Small Outline Integrated Circuit (SOIC): A smaller version of the DIP, useful for space-saving applications.
  4. Quad Flat Package (QFP): Features pins on all four sides, ideal for higher pin counts without increasing footprint size excessively.

  5. Ball Grid Array (BGA): Utilizes an array of solder balls for connection, offering high density and excellent thermal performance, commonly used in microprocessors and other complex ICs.

  6. Chip-On-Board (COB): The unpackaged die is directly attached to the PCB and covered with a protective epoxy. This method is cost-effective and suitable for high-volume production.

  7. Pin Grid Array (PGA): Uses an array of pins on the underside of the package, often socketed, and is popular in microprocessor packaging for providing excellent electrical and thermal performance.

  8. Land Grid Array (LGA): Similar to BGA, but uses flat contacts instead of solder balls, it is designed for socketed connections, frequently seen in CPUs.

  9. Plastic Leaded Chip Carrier (PLCC): A square or rectangular plastic package that typically has J-leaded pins, allowing for easy insertion in sockets or surface mounting.

  10. Ceramic Dual In-line Package (CerDIP): Similar in shape to the traditional DIP but made from ceramics, offering improved thermal performance and reliability for high-frequency and military applications.

These packaging forms cater to various needs, from cost savings and ease of use to performance optimization and miniaturization.

Back to Lisa's Column