As electronics have become miniaturized, the technologies used to route interconnects have been pushed to their limits, and new modes of designing PCBs with high reliability have become standard. HDI PCBs take a particular approach to routing interconnects through multiple layers to ensure reliability during fabrication, assembly, and operation. The critical structure that enables this is microvias, which are prone to failure if not designed properly. Some simple design decisions will have a major impact on reliability and solvability in an HDI PCB layout.
- Warnings from the IPC regarding reliability of via structures in HDI PCBs
- How to design microvias to ensure reliability
- How to create a PCB stackup for a high density circuit board
- How to set up design rules for layout and routing in HDI PCB design