1) For PCB boards that often need to be plugged and unplugged, the gold fingers usually need to be plated with hard gold to increase the wear resistance of the gold fingers;
For gold finger PCBs that do not require high wear resistance, the whole board immersion gold process can be selected, which has excellent balance and solderability, and is suitable for #highprecision PCB boards with key positions, binding IC, BGA and other designs.
2) The gold finger needs to be chamfered, usually 45°, and other angles such as 20°, 30°. If there is no chamfer in the design, there will be problem.
3) The minimum distance between the pad and the top of the finger is 14mil; it is recommended that the pad should be more than 1mm away from the finger in the design, including the via pad.
4) Do not lay copper on the surface of the gold finger. All layers of the inner layer need to be cut with copper. Usually, the width of the copper cut is 3mm larger, and the impedance of the gold finger is relatively low. Copper cutting can reduce the impedance difference between the gold finger and the impedance line, and also good for ESD.