๐ฆ๐๐ฏ๐๐๐ฟ๐ฎ๐๐ฒ-๐๐ถ๐ธ๐ฒ ๐ฃ๐๐: ๐ง๐ต๐ฒ ๐๐ผ๐บ๐ฝ๐น๐ฒ๐๐ฒ ๐ฎ๐ฌ๐ฎ๐ฎ ๐จ๐ฝ๐ฑ๐ฎ๐๐ฒ๐ฑ ๐๐๐ถ๐ฑ๐ฒ
Substrate-like PCB (SLP) describes the transition of a PCB board into a product with package substrate-like features. Substrate-like-PCB operates in thin conductors/interconnectors which efficiently transfers signal and power to every connected component and reduces power consumption. Substrate-like PCBs (SLPs) are known to be the next evolution of high-end high-density interconnector PCBs with higher density. The printed circuit board (PCB) is to back electrically and mechanically connect the electronic components to be used in electronic products. Substrate-like PCB technology will replace already present HDI PCB technology. It is still a kind of rigid PCB, but its production process is closer to semiconductor specifications.
Analysis By Line/Space
>25/25 and 30/30 ยตm
>Less than 25/25 ยตm
Inspection Technologies (Automated Optical Inspection, Direct Imaging, and Automated Optical Shaping)
Analysis By Line/Space
>25/25 and 30/30 ยตm
>Less than 25/25 ยตm
Inspection Technologies (Automated Optical Inspection, Direct Imaging, and Automated Optical Shaping)