Substrate-like PCB (SLP) describes the transition of a PCB board into a product with package substrate-like features. Substrate-like-PCB operates in thin conductors/interconnectors which efficiently transfers signal and power to every connected component and reduces power consumption. Substrate-like PCBs (SLPs) are known to be the next evolution of high-end high-density interconnector PCBs with higher density. The printed circuit board (PCB) is to back electrically and mechanically connect the electronic components to be used in electronic products. Substrate-like PCB technology will replace already present HDI PCB technology. It is still a kind of rigid PCB, but its production process is closer to semiconductor specifications.
Analysis By Line/Space
>25/25 and 30/30 µm
>Less than 25/25 µm
Inspection Technologies (Automated Optical Inspection, Direct Imaging, and Automated Optical Shaping)