2-layer vs. 4-layer PCB

What is a 2-layer PCB?

A 2-layer PCB, as indicated by its name, is composed of a pair of conductive layers, usually made of copper, with an insulating substrate in between.

2-layer PCB
2-layer PCB

These layers are usually placed on opposite sides of the substrate, allowing for electrical connections through vias, which are conductive holes that pass through the board.

These types of PCBs are often employed in less complex electronic gadgets or when there are significant limitations regarding cost and space.

What is a 4-layer PCB?

A 4-layer PCB features four conductive layers, where the two inner layers are enclosed by the external layers.

4-layer PCB
4-layer PCB

The conductive layers are separated by insulating materials, while vias are used to establish connections between the layers.

This configuration provides greater design versatility and enhanced signal integrity compared to double layer PCB. They are typically used in complex devices and high-frequency applications.

What is the difference between a 2-layer and 4-layer PCB?

The number of conductive layers and their arrangement is the primary difference between 2-layer vs. 4-layer PCB. The below table contains the in-depth difference between the two:

Differences between 2-layer vs. 4-layer PCB:

                           2-layer PCB                       4-layer PCB

Number of Conductive Layers

 

Two conductive layers on opposite sides of the substrate Four conductive layers, including two internal layers sandwiched between the outer layers

Design Complexity

 

Suitable for simpler circuits and designs with fewer components Accommodates complex designs, higher component density, and intricate routing

Signal Integrity

 

Lower signal integrity, especially in high-frequency applications Higher signal integrity due to dedicated power and ground planes, resulting in reduced crosstalk and signal noise
Electromagnetic Compatibility (EMC) Performance Inferior EMC performance, more susceptible to interference and noise Enhanced EMC performance, providing better noise reduction and shielding
Power Distribution Limited options for power distribution, which may cause issues with noise and signal integrity Dedicated power and ground planes improve power distribution, reducing voltage drops and noise
Thermal Management Less effective in dissipating heat, which may lead to overheating and performance issues Improved thermal management due to the presence of internal ground and power planes, which help distribute and dissipate heat more efficiently
Manufacturing Complexity Easier to manufacture, with fewer steps and simpler processes More complex manufacturing process due to additional layers and requirements for accurate alignment
Routing Flexibility Limited routing flexibility, which may require more design iterations and compromises Greater routing flexibility, allowing for more efficient use of space and easier design modifications

2-layer vs. 4-layer PCB stack up

The stack-up refers to a PCB’s conductive and insulating layers. A standard 2-layer PCB structure is composed of a substrate (commonly crafted from FR4 material), conductive layers on the top and bottom surfaces, and solder masks that cover each of the conductive layers.

2-layer vs. 4-layer PCB stack up
2-layer vs. 4-layer PCB stack up

On the other hand, a 4-layer PCB structure incorporates two additional internal layers between the external conductive layers, which are often designated for power and ground planes.

The stack-up may look like this: top layer (signal), prepreg (insulating material), inner layer 1 (ground), core (insulating material), inner layer 2 (power), prepreg (insulating material), and bottom layer (signal).

Solder masks are also applied to the top and bottom layers. The design of a 4-layer PCB offers improved signal integrity, reduced noise, and enhanced EMC performance in comparison to 2-layer PCBs.

This configuration provides greater design versatility and enhanced signal integrity compared to double layer PCB. They are typically used in complex devices and high-frequency applications.