Rule 1: Choose the right grid-set and always use the grid spacing that matches the most components.
Rule 2: Keep the path shortest and most direct.
Rule 3: Use the power layer as much as possible to manage the distribution of power lines and ground lines.
Rule 4: Group related components together with the required test points.
Rule 5: Copy the required circuit board on another larger circuit board multiple times for PCB imposition.
Rule 6: Integrate component values.
Rule 7: Perform design rule checks (DRC) as much as possible.
Rule 8: Use screen printing flexibly.
Rule 9: Decoupling capacitors must be selected.
Rule 10: Generate PCB manufacturing parameters and verify them before submitting for production.