In the PCBA processing and production process, it is difficult to avoid the problem of material throwing from the placement machine. Part throwing mainly refers to the fact that during the PCBA processing process, the placement machine does not stick the components to the designated position after sucking the materials, but throws the components into the throwing box or other places, or does not suck them. To perform one of the above throwing actions.
Throwing out parts will not only cause material loss, but also reduce production efficiency and increase production costs. Therefore, in order to improve chip production efficiency and reduce costs, the phenomenon of material throwing needs to be solved in time.
We know that material throwing often occurs during PCBA processing. Material throwing not only affects production, but also is an important factor affecting production costs.
So what happens when the parts are printed and patched? The so-called material throwing means that during the production process, the chip placement machine does not stick the material after sucking it, but throws the material into the material throwing box or other places, or performs the above throwing action without sucking the material.
Throwing causes material loss, prolongs production time, reduces production efficiency, and increases production costs. In order to optimize production efficiency and reduce costs, the problem of high throwing rate must be solved.
PCBA processing and production
The main reasons and solutions for throwing materials
1. Vacuum problem,
Insufficient air pressure is usually caused by the vacuum air pipe channel being blocked or leaking. When the air pressure is insufficient, the material cannot be picked up normally. It is usually impossible to pick it up or it will fall off on the way to apply.
Solution: Adjust the air pressure steep slope to the air pressure value required by the equipment (such as 0.5~0.6Mpa – YAMAHA chip placement machine), clean the air pressure pipeline, and repair the leaking air path.
2. Programming problem,
The parameter settings of the components in the edited program are incorrect, and they do not match the size, brightness and other parameters of the incoming material, resulting in failed recognition and being discarded. Countermeasures: Modify component parameters and search for optimal parameter settings for components.
Solution: Modify the component parameters and search for the best parameter settings for the component.
3. Problems with incoming materials,
The incoming materials are irregular and are substandard products such as pin oxidation. Countermeasures: IQC does a good job in inspecting incoming materials, detecting defective components in a timely manner, and keeping defective products out of the production line;
Solution: IQC conducts inspection of incoming materials and contacts component suppliers.
4. Feeder problem,
The feeder position is deformed, the feeder feeds poorly (the feeder ratchet gear is damaged, the material belt hole is not stuck on the feeder ratchet gear, there is foreign matter under the feeder, the spring is aging, or the power is poor), The result is that the material cannot be retrieved or is poorly retrieved and the material is thrown away, and the feeder is damaged.
Solution: Adjust the feeder, clean the feeder platform, and replace damaged parts or feeders.
5. Nozzle problem
The suction nozzle of the placement machine is deformed, clogged, etc., which leads to insufficient air pressure, air leakage, etc., which in turn results in the inability to properly absorb materials and incorrect material picking, and the phenomenon of material throwing due to failure in identification.
Solution: Clean and replace the nozzle of the placement machine.
6. Identify system problems
The identification of the placement machine or the laser lens of the part processing is contaminated, there are debris interfering with the identification, the light source is improperly selected and the intensity and grayscale are not enough, or the identification system is damaged.
Solution: Clean the surface of the recognition system, keep the monitor clean and free of debris, adjust the intensity and grayscale of the light source, and replace damaged parts if the recognition system is damaged.
7. Location problem
The material is not taken at the center of the material, and the height of the material is incorrect (generally, the pressure is 0.05MM after touching the part), resulting in offset bits. The material is not taken correctly or offset, and the identification does not match the corresponding data parameters and is detected. The identification system discards it as invalid material.
Solution: Adjust the picking position.
8. PCB quality issues
The thickness of the PCB, the degree of warpage of the PCB board exceeds the allowable error of the equipment, and there is a problem with the placement of the PCB board support pins. When the PCB is mounted on both sides, the support pins on both sides press against the bottom components of the PCB, causing the PCB to warp upward.
Solution: Choose a PCB suitable for mounting
Solving these parts throwing problems requires careful inspection of the part production line and determining the root cause of the problem. It is usually necessary to adjust the quantity and quality of solder paste, ensure that the viscosity and temperature are correct, check whether the placement head is flat and intact, remove dirt and grease on the PCB board, ensure that the size and quality of electronic components meet the requirements, and ensure that the placement The program settings are correct.