Nowadays, the size requirements of electronic products are getting smaller and smaller, and PCBA assembly must pay close attention to problems that easily occur during welding.
For example, PCBA bridging, a common defect is when the solder flows directly on the connector during soldering at high temperatures, causing bridging. Bridging is one of the common defects in PCBA assembly. It can cause short circuits between components, and must be repaired if bridging is encountered.
Bridging can occur at different stages of the PCBA assembly process. So what is the reason for the bridge connection? Is there any solution to avoid bridging? Today PCBA assembly factory iPCB is here to learn about the relevant knowledge about bridging with everyone.
PCBA assembly
Causes of PCBA bridging
1. PCB design issues: The larger and heavier components of the PCB are placed on the same side, causing uneven weight distribution of the PCB and causing tilt.
2. The direction of the components is reversed.
3. Lack of redundancy in the space between gaskets.
4. The reflow oven temperature curve setting is unscientific.
5. The patch pressure setting is unreasonable, etc.
PCBA welding solutions
1. PCB circuit board design: Strictly carry out scientific planning at the circuit board design level, reasonably distribute the weight of components on both sides, open air holes and through-holes, adjust the spacing between dense components, and add solder resist layers appropriately, etc. wait.
2. Reflow oven temperature curve: In PCBA assembly, literally speaking, when the liquid solder melts, the activity of the solder at the higher end is higher. If the reflow soldering temperature curve is set unreasonably, it will cause disordered flow of solder paste. Chance of adding new bridge connection.
3. Choose a solder paste printer: A solder paste printer does not need to apply solder paste through a stencil. This will reduce solder paste contact caused by unscientific template opening, stencil warping, and stencil separation. Poor coating.
4. Reasonably control the amount of solder paste: Reasonably control the amount of solder paste applied to reduce the problem of excessive solder paste collapse and high fluidity.
5. Properly set the solder mask: Properly setting the solder mask goes a long way in reducing the risk of solder bridging.
After understanding how to prevent PCBA soldering and PCBA bridging, you can focus on issues related to their processes, PCB design, reflow curves, etc. when reviewing PCBA assembly plants to reduce uncontrollable costs caused by problems.