PCB circuit board is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. In the process of PCB manufacturing and processing, it is necessary to go through the process of baking the circuit board. So what are the requirements and precautions for the PCB baking plate and baking plate?
PCB baking requirements
1. Check regularly and at fixed points whether the material storage environment is within the specified range.
2. Staff must be trained.
3. If there is any abnormality in the PCB baking process, relevant technical personnel must be notified in time.
4. Anti-static and heat insulation measures must be taken when coming into contact with materials.
5. Lead-containing materials and lead-free materials need to be stored and baked separately.
6. After baking is completed, it must be cooled to room temperature before being put on the line or packaged.
PCB baking pipe
1. Large PCBs are mostly placed flat, with a maximum of 30 pieces stacked. Take the PCB out of the oven within 10 minutes after baking is completed, and place it flat at room temperature to cool naturally.
2. Small and medium-sized PCBs are mostly placed flat, with a maximum of 40 pieces stacked. There is no limit to the number of uprights. Remove the PCB from the oven within 10 minutes after baking is completed, and place it flat at room temperature to cool naturally.
PCB baking precautions
1. If an oven is used for the PCB circuit board, it must be equipped with air blast and constant temperature control to ensure uniform pre-baking temperature. Moreover, the oven should be clean and free of impurities to avoid falling on the board and damaging the membrane surface.
2. Do not use natural drying, and the drying must be complete, otherwise it will easily stick to the film and cause poor exposure.
3. After PCB circuit board processing and pre-baking, the multi-layer circuit board should be air-cooled or naturally cooled before film alignment exposure.
4. After pre-baking the multi-layer circuit board, the time from coating to development should not exceed two days at most. When the humidity is high, try to expose and develop within half a day.
5. Different models of liquid photoresist have different requirements. You should read the instructions carefully and adjust the process parameters, such as thickness, temperature, time, etc., according to production practice.
6. It is important to control the pre-baking temperature and time. If the temperature is too high or the time is too long, it will be difficult to develop and remove the film. If the temperature is too low or the time is too short, the drying will be incomplete and the film will be pressure-sensitive, which will easily stick to the film, causing poor exposure and damage to the film. Therefore, if the multi-layer circuit board is processed and pre-baked properly, the development and film removal will be faster and the graphics quality will be good.
The above is the analysis of PCB circuit board baking requirements and precautions introduced by PCB manufacturer Audemars Piguet. I hope it can provide you with a reference.