In PCB design, common errors often occur due to negligence or neglect of details during the design process. Here are 10 of the most common errors that are easily overlooked:
1. Irregular pad design: including incorrect pad size, too large or too small pad spacing, asymmetric pads, etc. These problems may cause poor soldering, displacement, tombstones, etc. during welding
2. Mark point design is not standardized: Mark points are used for machine recognition. If the design is not standardized or missing, it will cause difficulty in machine recognition.
3. Insufficient test point design: Insufficient test points will make fault diagnosis difficult. Necessary test points and debugging interfaces should be included in the design
4. Insufficient mechanical design: Insufficient mechanical strength of the PCB may cause damage during assembly or use. The thickness, material and support structure of the board need to be considered to improve mechanical stability.
5. Improper stacking design: Unreasonable stacking design will lead to impedance mismatch and signal quality problems. The electrical performance and manufacturing cost should be balanced, and the choice of board should be considered.
6. Characters are placed randomly: Improper character design (such as too small or too large), or characters covering the pads, will cause inconvenience to the continuity test of the printed circuit board and the welding of components.
7. Abuse of graphic layers: Making useless connections on some graphic layers or designing component surfaces on inappropriate layers may lead to misunderstandings or processing difficulties
8. Inadequate power and ground design: Unstable power and ground will affect the performance of the entire circuit. Make sure that the layout of the power and ground can provide stable current and reduce voltage drop and noise
9. Ignoring electromagnetic compatibility (EMC): Designing without considering EMC may cause the product to fail radiation and immunity tests. Shielding, grounding and filtering techniques should be used to reduce the impact of EMI.
10. Failure to consider manufacturing limitations: Failure to consider manufacturing capabilities during design may lead to production difficulties or increased costs. It is critical to understand the manufacturer's capabilities and communicate them in the early stages of the design.
These mistakes often stem from oversights or inattention to detail during the design process. With careful planning, expertise and experience, these mistakes can be avoided.