hybrid PCB thermal dissipation
The biggest challenges to hybrid PCBs are the laminate construction (stack-up) and PP in the materials connection areas.
For laminate construction of hybrid PCBs, the coefficient of thermal expansion (CTE) of FR4, AlN, alumina, copper, aluminum, PTFE, PI, and PET are different. With the changes in temperatures and pressure, the sizes of the main board and inlay areas also change. You should not only consider CTE of different materials and mechanical tolerances but also have good control of the lamination specs such as temperatures. Otherwise, improper laminate construction will cause delamination and breaking boards.
Besides, keep in mind that PTFE is a soft material and has a sensitive CTE. If PTFE shrinks or expands, its RF characteristics will be affected. And if the size is too big, the ceramic material is easy to break.
Speaking of PP, it is the second challenge of hybrid PCBs. During lamination, PP of the same layer overflows to fill up the connection areas. The flow speed and amount of PP affect the integration of different materials. For thermal management solutions, you should use special PP to dissipate heat.
Rich experience is needed for solving these challenges of hybrid PCBs. And we recommend early involvement from your PCB fabricator in the PCB design/project development phase.
hybrid PCB solution from PCBHERO
PCBHERO, a one-stop PCB manufacturer, can provide you with reliable hybrid PCB fabrication and assembly. Founded in 1999, we have two large manufacturing bases and one PCB assembly factory. By ordering hybrid PCBs from PCBHERO, you can enjoy these advantages from us: